Array substrate for lcd

ABSTRACT

An array substrate ( 100   a ) includes a transparent substrate ( 304 ), a first insulation layer ( 306 ) and a pixel electrode ( 103 ). The transparent substrate ( 304 ) includes a display region (DR) that displays an image, a peripheral region (PR) having a driving circuit ( 101 ) for displaying an image through the display region, and a sealine region (SLR) that surrounds the display region (DR) to define the display region and the peripheral region (PR). The first insulation layer ( 306 ) is formed over the transparent substrate ( 304 ), and the first insulation layer ( 306 ) has an opening window ( 301 ) in the sealine region (SLR). The pixel electrode ( 103 ) is formed on the first insulation layer ( 306 ) of the display region (DR). The bonding between a color filter substrate ( 401 ) and an array substrate ( 100   a ) is improved. Furthermore, liquid crystal material is completely filled into between the color filter substrate and the array substrate.

TECHNICAL FIELD

The present invention relates to an array substrate, a method ofmanufacturing the array substrate, a liquid crystal display apparatushaving the arrays substrate and a method of manufacturing the liquidcrystal display apparatus. More particularly, the present inventionrelates to an array substrate for a strong bonding with a color filtersubstrate, a method of manufacturing the array substrate, a liquidcrystal display apparatus having the arrays substrate and a method ofmanufacturing the liquid crystal display apparatus.

BACKGROUND ART

Recently, a liquid crystal display apparatus is widely used, because theliquid crystal display apparatus has lightweight, thin thickness and lowpower consumption.

The liquid crystal display apparatus includes a liquid crystal displaypanel and a backlight assembly. The backlight assembly provides light tothe liquid crystal display panel. The liquid crystal display panelincludes a color filter substrate and an array substrate. The colorfilter substrate includes color filters through which the light havingspecific wavelengths may pass to display colored images. The colorfilter includes a common electrode. A reference voltage is applied tothe common electrode.

The array substrate employs a thin film transistor as a switchingdevice. The thin film transistor includes a gate electrode, a drainelectrode and a source electrode. The gate electrode is electricallyconnected to a gate line. The drain electrode is electrically connectedto a pixel electrode. The source line is electrically connected to adata line. When a gate voltage is applied to the gate line, the thinfilm transistor is turned on, so that a pixel voltage is applied to thepixel electrode via the thin film transistor.

A liquid crystal layer is interposed between the color filter substrateand the array substrate. When the pixel voltage is applied to the pixelelectrode, electric fields are formed between the pixel electrode andthe common electrode. The electric fields change the arrangement of theliquid crystal molecules of the liquid crystal layer to change thetransmittance of light provided from the backlight assembly. Therefore,an image is displayed.

According to the conventional liquid crystal display apparatus, the dataline does not overlap with the pixel electrode to avoid the increase inpower consumption from the cross-talk due to the parasitic capacitanceformed between the data line and the pixel electrode when the data lineoverlaps with the pixel electrode.

However, when the data line does not overlap with the pixel electrode,the distance between the pixel electrodes increases due to the data linethat is disposed between the pixel electrodes. Therefore, aperture ratiois lowered. Furthermore, the light leakage between the data line and thepixel electrode causes lower luminance.

In order to avoid above-mentioned problems, an insulation layer isformed between the data line and the pixel electrode. Therefore, aportion of the data line may overlap with the pixel electrode toincrease the aperture ratio.

The insulation layer has a low dielectric constant. Furthermore, whenthe insulation layer is formed, the distance between the data line andthe pixel electrode increases. Therefore, even when a portion of thedata line overlaps with the pixel electrode, a parasitic capacitanceformed between the data line and the pixel electrode becomes negligiblysmall. Therefore, the insulation layer formed between the pixelelectrode and the data line increases the aperture ratio and preventsthe leakage of the light from the backlight assembly.

However, when the insulation layer is formed, the bonding strengthbetween the sealant that combines the color filter substrate and thearray substrate, and the insulation layer, or the bonding strengthbetween the insulation layer and the gate insulation layer becomesfragile. Thus, a weak impact may separate the color filter substratefrom the array substrate. Even though the color filter substrate is notcompletely separated from the array substrate, liquid crystal materialis not completely injected into between the color filter substrate andthe array substrate due to the crack formed between the sealant and theinsulation layer or between the insulation layer and the gate insulationlayer, which lowers the productivity.

DISCLOSURE OF INVENTION

Technical Problem

The present invention provides an array substrate for a strong bondingwith a color filter substrate.

The present invention also provides a method of manufacturing the arraysubstrate.

The present invention also provides a liquid crystal display apparatushaving the array substrate.

The present invention also provides a method of manufacturing the liquidcrystal display apparatus.

Technical Solution

In accordance with an exemplary array substrate of the presentinvention, the array substrate includes a transparent substrate, a firstinsulation layer and a pixel electrode. The transparent substrateincludes a display region that displays an image, a peripheral regionhaving a driving circuit for displaying an image through the displayregion, and a sealine region that surrounds the display region to definethe display region and the peripheral region. The first insulation layeris formed over the transparent substrate, and the first insulation layerhas an opening window in the sealine region. The pixel electrode isformed on the first insulation layer of the display region.

In accordance with an exemplary liquid crystal display apparatus, theliquid crystal display apparatus includes an array substrate, a colorfilter substrate, a liquid crystal layer and a sealing member. The arraysubstrate includes a transparent substrate, a first insulation layer,and a pixel electrode. The transparent substrate has a display regionthat displays an image, a peripheral region having a driving circuit fordisplaying an image through the display region, and a sealine regionthat surrounds the display region to define the display region and theperipheral region. The first insulation layer is armed over thetransparent substrate, and the first insulation layer has an openingwindow in the sealine region. The pixel electrode is formed on the firstinsulation layer of the display region. The color filter substrate facesthe array substrate. The liquid crystal layer is interposed between thearray substrate and the color filter substrate. The sealing member isformed at the opening window to combine the array substrate and thecolor filter substrate.

In accordance with an exemplary method of firming an array substrate, afirst insulation layer is formed over the transparent substrateincluding a display region that displays an image, a peripheral regionhaving a driving circuit for displaying an image through the displayregion, and a sealine region that surrounds the display region to definethe display region and the peripheral region. A portion of the firstinsulation layer is removed to form an opening window in the sealineregion. Then, a pixel electrode is formed on the first insulation layerof the display region.

In accordance with an exemplary method of forming a liquid crystaldisplay apparatus, an array substrate including i) a transparentsubstrate including a display region that displays an image, aperipheral region having a driving circuit for displaying an imagethrough the display region, and a sealine region that surrounds thedisplay region to define the display region and the peripheral region,ii) a first insulation layer formed over the transparent substrate, thefirst insulation layer having an opening window in the sealine region,and iii) a pixel electrode formed on the first insulation layer of thedisplay region is formed. A sealing member is formed at the openingwindow. A color filter substrate is attached to the sealing member toassemble the array substrate and the color filter substrate. Then, aliquid crystal layer is formed between the array substrate and the colorfilter substrate.

According to the present invention, the bonding of a color filtersubstrate and an array substrate is reinforced.

Furthermore, a liquid crystal material is completely filled in betweenthe color filter substrate and the array substrate, which increases theproductivity.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other advantages of the present invention will becomereadily apparent by reference to the following detailed description whenconsidered in conjunction with the accompanying drawings wherein:

FIG. 1 is a schematic plan view showing an array substrate;

FIG. 2 is a schematic layout showing an array substrate;

FIGS. 3 and 4 are schematic perspective view showing exemplary openingwindows formed on an insulation layer of FIG. 2;

FIG. 5 is a cross-sectional view taken along a line A-A′ of FIG. 2according to a first exemplary embodiment of the present invention;

FIG. 6 is a cross-sectional view taken along a line A-A′ of FIG. 2according to a second exemplary embodiment of the present invention;

FIG. 7 is a schematic cross-sectional view showing a liquid crystaldisplay apparatus according to a third exemplary embodiment of thepresent invention; and

FIGS. 8 to 11 are schematic views showing a process of injecting liquidcrystal.

BEST MODE FOR CARRYING OUT THE INVENTION

FIG. 1 is a schematic plan view showing an array substrate.

Referring to FIG. 1, an array substrate 100 includes a display region DRand a peripheral region PR. The display region DR displays an image, andthe peripheral region includes a driving circuit, such as a gate drivingcircuit 101. A data driving circuit (not shown) is made in the form ofseparate chip, and the data driving circuit is electrically connected tothe array substrate 100. The data driving circuit is also disposed onthe peripheral region PR.

A sealine region SLR is disposed between the display region DR and theperipheral region PR, such that the sealine region SLR divides thedisplay region DR and the peripheral region PR. A sealing member (notshown) for bonding the array substrate and a color filter substrate (notshown) is to be disposed on the sealine region SLR.

The display region DR includes a plurality of gate lines 203 arranged inparallel each other, and a plurality of data lines 102 arrangedperpendicular to the gate lines 203. The gate lines 203 and the datalines 102 are formed on different layers and electrically insulated fromeach other.

Each of the data lines 102 and gate lines 203 defines a pixel. Eachpixel includes a thin film transistor 201 and a pixel electrode 103.

The thin film transistor 201 includes a gate electrode G, a sourceelectrode S and a drain electrode D. The gate electrode G iselectrically connected to the gate line 203. The source electrode S iselectrically connected to the data line 102. The drain electrode iselectrically connected to the pixel electrode 103.

When a gate driving circuit (not shown) applies a gate driving voltageto the gate line 203, the thin film transistor 201 that is electricallyconnected to the gate line 203 is turned on. Then, a pixel voltage thatis applied by a data driving circuit (not shown) is applied to the pixelelectrode 103 via the thin film transistor 201.

FIG. 2 is a schematic layout showing an array substrate.

Referring to FIG. 2, a plurality of gate lines 203 and a plurality ofdata lines 102 are formed on different layers of a display region DR ofan array substrate 100. A pixel electrode 103 is electrically connectedto a thin film transistor 201 via a contact hole 513. A portion of thegate line 203 protrudes to form a gate electrode G of a thin filmtransistor 201. A gate insulation layer (not shown) is formed on thegate electrode G. An amorphous silicon layer (not shown) and n+amorphoussilicon layer are formed on the gate insulation layer, in sequence.Then, a drain electrode D and a source electrode S are formed on thegate n+ amorphous silicon layer.

A gate driving circuit 101 is formed in a peripheral region PR. Asealine region SLR is interposed between the peripheral region PR anddisplay region DR.

The sealine region SLR includes an opening window 301. A sealant thatcombines the array substrate 100 and a color filter substrate may betightly attached to the sealine region SLR by the opening window 301.That is, the bonding strength of the insulation layer (not shown) firmedon the array substrate 100 and the sealant is low. Therefore, theinsulation layer is removed to form the opening window 301. Then, thesealant is formed on the opening window 301. When the sealant isattached on the opening window 301, a contact area of the sealantincreases, and the sealant makes contact with not only the insulationlayer but also other layers to strengthen the bonding between thesealant and the array substrate 100.

Therefore, as long as the opening window 301 opens the insulation layerto increase contact area, the shape of the opening window 301 is notlimited. As an example, in FIG. 2, the opening window 301 extends in alongitudinal direction of the sealine region SLR. The shape of theopening window 301, however, and the number of the opening window arenot limited.

FIGS. 3 and 4 are schematic perspective views showing exemplary openingwindows formed on an insulation layer of FIG. 2.

Referring to FIGS. 3 and 4, a portion of an insulation layer 306 isremoved to form an opening window 301. The opening window 301 extends ina longitudinal direction of a sealine. The shape, the size and thenumber of the opening window 301 in FIGS. 3 and 4 do not limit the scopeof this invention.

FIG. 5 is a cross-sectional view taken along a line A-A′ of FIG. 2according to a first exemplary embodiment of the present invention, andFIG. 6 is a cross-sectional view taken along a line A-A′ of FIG. 2according to a second exemplary embodiment of the present invention.

Referring to FIGS. 5 and 6, array substrates 100 a and 100 b of FIGS. 5and 6, respectively, include a first transparent substrate 304, a thinfilm transistor 201, an insulation layer 306 and a pixel electrode 103.

The first transparent substrate 304 includes a display region DR, aperipheral region PR and a sealine region SLR that divides the displayregion DR and the peripheral region PR.

The display region DR displays an image, and the peripheral region PRincludes driving circuits for displaying an image. A sealant thatcombines the array substrates 100 a and 100 b with a color filtersubstrate is to be disposed in the sealine region SLR.

The display region DR of the first transparent substrate 304 includes aplurality of gate electrode G. A gate insulation layer 305 is armed onthe first transparent substrate 304, such that the gate insulation layer305 covers the gate electrode G. A source electrode S and a drainelectrode D are armed over the gate insulation layer D. An insulationlayer 306 is firmed thereon. The insulation layer 306 includes anopening window 301 and a contact hole 513. The opening window 301 isformed in the sealine region SLR. The contact hole 513 exposes drainelectrode D. A pixel electrode 103 formed on the insulation layer 306 iselectrically connected to the drain electrode D via the contact hole513.

Hereinafter, a method of manufacturing the array substrate will beexplained.

Aluminum neodymium (Al-Nd) alloy is deposited on the first transparentsubstrate 304 to form a layer. The layer comprising aluminum neodymium(Al-Nd) alloy is patterned via photolithography process and etched toform a gate electrode G.

When the gate electrode G is formed, a gate insulation layer (or asecond insulation layer) 305 is formed, such that the gate insulationlayer covers the gate electrode G.

The gate insulation layer comprises silicon nitride (SiNx).

An amorphous silicon layer 302 is formed on a portion of the gateinsulation layer 305, which is near the gate electrode G.

An n+ amorphous silicon layer 303 is formed on the amorphous siliconlayer 302.

The gate insulation layer 305 has a high resistivity at a lowtemperature, so that the carriers of the amorphous silicon layer, when avoltage is applied to the gate electrode, do not leak but gathertogether at an interface between the amorphous silicon layer 302 and n+amorphous silicon layer 303 to form a channel layer.

The amorphous silicon layer 302 has a resistivity ranged from about 10¹¹Ωcm⁻¹ to about 10¹² Ωcm⁻¹. When a gate voltage is applied to the gateelectrode G, the resistivity of the amorphous silicon layer 302 islowered to be 10⁵ Ωcm⁻¹ to about 10⁶ Ωcm⁻¹.

Therefore, current may pass through the amorphous silicon layer.

The n+ amorphous silicon layer 303 reduces a contact resistance betweena metal of the source electrode S and the drain electrode D, and theamorphous silicon layer 302, and the n+ amorphous silicon layer 303reduces leakage current. Phosphorus (P) atoms are doped to form the n+amorphous silicon layer 303.

Then, the drain and source electrodes D and S are firmed on the n+amorphous silicon layer 303. The drain and source electrodes D and Scomprise chromium.

A gate driving circuit 101 is farmed in the peripheral region PR of thefirst transparent substrate 304. A data driving circuit (not shown) maybe made in the form of separate chip, and the chip is disposed in theperipheral region PR.

After the drain and source electrodes D and S are formed, an insulationlayer (or a first insulation layer 306) is formed. The insulation layer306 increases an aperture ratio and luminance. The insulation layer 306includes a material capable of photolithography process.

The opening window 301 is formed in the sealine region SLR, and theopening window 301 penetrates the insulation layer 306. The openingwindow 301 may penetrate only the insulation layer 306 to expose thegate insulation layer 305 as shown in FIG. 5, or the opening window 306may penetrate both the insulation layer 306 and the gate insulationlayer 305 to expose the first transparent substrate 304 as shown in FIG.5.

The opening window 301 may be armed ty dry etching. When the openingwindow 301 is formed, a sealant (not shown) is attached on the arraysubstrates 100 a and 100 b more tightly.

A contact hole 513 for exposing the drain electrode is formed at theinsulation layer 306. The contact hole 513 and the opening window 301may be formed via a same process or different process.

A layer comprising an optically transparent and electrically conductivematerial, for example, such as indium tin oxide (ITO), indium zinc oxide(IZO), etc. is formed on the insulation layer 306, and the layer ispatterned to form the pixel electrode 103.

The indium tin oxide and the indium zinc oxide have excellentconductivity and are also chemically and thermally stable.

FIG. 7 is a schematic cross-sectional view showing a liquid crystaldisplay apparatus according to a third exemplary embodiment of thepresent invention.

Referring to FIG. 7, a liquid crystal display apparatus according to athird exemplary embodiment of the present invention includes a colorfilter substrate 401, an array substrate 100 and a liquid crystal layer402 interposed between the color filter substrate 401 and the arraysubstrate 100.

The color filter substrate 401 includes a second transparent substrate407, a color filter 405, a leveling layer 404, a common electrode 403and a black matrix 406.

The black matrix 406 and the color filter 405 are formed on the secondtransparent substrate 407. The leveling layer 404 covers the blackmatrix 406 and the color filter 405. The common electrode 403 is formedon the leveling layer 404.

The color filter 405 includes a red color filter R, a green color filterG and a blue color filter B. When a light passes through the red, greenand blue color filters R, G and B, the light is filtered to display ared, green and blue light, respectively.

A liquid crystal display apparatus is classified into stripe type,mosaic type, a triangular type, etc in accordance with an arrangement ofthe red, green and blue color filters. The stripe type is adequate for amonitor of a computer system, and the mosaic type and the triangulartype are adequate or a television set.

The black matrix 406 covers the driving circuit firmed on the arraysubstrate to prevent the driving circuit, etc. from being seen. Theblack matrix 406 comprises metal or organic material.

The leveling layer 404 protects the color filter 405, and increases theflatness by decreasing the height differences. The leveling layer 404comprises acryl resin or polyimide resin.

The common electrode 403 comprises a material that is opticallytransparent and electrically conductive, for example, such as indium tinoxide (ITO), indium zinc oxide (IZO), etc.

Hereinafter, a method of forming the color filter substrate 401 will beexplained.

The black matrix 406 is formed on the second transparent substrate 407.The black matrix 406 comprises metal or organic material.

A metal black matrix is classified into chromium (Cr) black matrix, adouble-layered chromium black matrix (Cr/CrOx) or a triple-layeredchromium black matrix (Cr/CrNx/CrOx). An organic black matrix is dividedinto a carbon black type black matrix, an RGB pigment black matrix, adye dispersion type black matrix, and an RGB overlapping type blackmatrix.

The color filter 405 is formed on the second transparent substrate 407.The color filter 405 includes a red color filter R, a green color filterG and a blue color filter B. The color filter 405 may be formed usingdyes or pigments. A method of forming the color filter 405 using dyes isclassified into a dyeing process and a dye dispersion process, and amethod of arming the color filter 405 using pigments is classified intoa pigment dispersion process, a printing process and an adhesionprocess.

In the dyeing process, acryl resin, casein, gelatin, etc are used as acoloring resin, and dye is used as a coloring matter. The dyeing processis adequate for a minute opening window, but the color filter 405 formedby the dyeing process has a low durability.

In the dye dispersion process, polyimide is used as the coloring resin,and dye is used as the coloring matter. The dye dispersion process isalso adequate for a minute opening window, but the color filter 405formed by the dye dispersion process has a low durability.

In the pigment dispersion process, acryl resin is used as the coloringresin, and pigments are used as the coloring matter. The color filters405 formed b the pigment dispersion process have a good lightproofproperty and a good thermal stability. However, oxygen preventing layeris required additionally.

In the printing process, epoxy resin is used as the coloring resin, andthe pigments are used as the coloring matter. The color filters 405armed by the printing process have a good lightproof property and a goodthermal stability, but a bad resolution and flatness.

In the adhesion process, both the acryl resin and the epoxy resin areused as the coloring resin, and the pigments are used as the coloringmatter. The color filters 405 formed by the adhesion process have a goodlightproof property, a flatness and a good thermal stability, but thepatterning is limited.

The dyeing process, the dye dispersion process and the pigmentdispersion process are adequate for the stripe, mosaic and triangulartype arrangements of the color filters. The printing process and theadhesion process are adequate for the stripe arrangement, but not forthe mosaic, and triangular type arrangements.

The leveling layer 404 is formed on the black matrix 406 and the colorfilter 405. The leveling layer 404 comprises acryl resin or polyimideresin.

When the acryl resin is used for the leveling layer 404, the acryl resinis mixed with a hardener to form the leveling layer 404. The polyimideresin is costing much, but the polyimide resin has a good thermalstability.

When the leveling layer 404 is armed, a hardening process is performed.

Both the acryl resin and the polyimide resin are thermosetting plastic.Therefore, heat treatment is important. Additionally, when the hardeningprocess is defectively performed, the common electrode 403 that is to bearmed on the leveling layer 404 may be corrugated or fragile. Therefore,the leveling layer 404 is sufficiently hardened.

The common electrode 403 is formed on the leveling layer 404. The commonelectrode 403 comprises a material that is optically transparent andelectrically conductive, for example, such as indium tin oxide (ITO),indium zinc oxide (IZO), etc.

Hereinbefore, a method of forming the color filter substrate 401 wasexplained. A method of forming the array substrate 100 was explainedalready.

The color filter substrate 401 and the array substrate 100 are bondedtogether by the sealant (408). The sealant 408 is firmed along thesealine region SLR of FIG. 1, such that the sealant 408 surrounds thedisplay region DR. A small portion of the sealant 408, however, isopened.

The sealant 408 makes contact with the gate insulation layer 305 or thefirst transparent substrate 304 via the opening window 301 formed at theinsulation layer 306.

A spacer 514 maintains a distance between the array substrate 100 andthe color filter substrate 401 that is bonded by the sealant 408. Thespacer 514 is disposed over the contact hole 513. The black matrix 406covers the spacer 514 to prevent the spacer 514 from being seen outside.

When the color filter substrate 401 are assembled with the arraysubstrate 100, liquid crystal is injected into between the color filtersubstrate 401 and the array substrate 100 to form a liquid crystallayer.

FIGS. 8 to 11 are schematic views showing a process of injecting liquidcrystal.

Referring to FIG. 8, a bonded module 601 of the color filter substrate401 and the array substrate 100 is loaded in a chamber 600.

Then, a pressure of the chamber 600 is lowered to be about 5×10⁻³ Torr.

Referring to FIG. 9, the chamber 600 is closed, and the bonded module601 of the color filter substrate 401 and the array substrate 100 isdipped into the liquid crystal material 602. A pressure of the spacebetween the color filter substrate 401 and the array substrate 100 issame as the pressure of the chamber. Thus, the liquid crystal materialis not injected into between the space between the color filtersubstrate 401 and the array substrate 100.

Referring to FIGS. 10 and 11, the chamber 600 is opened and the inertgas is injected into the chamber to raise the pressure of the chamber.Then, the pressure of the chamber is higher than the pressure of thespace between the color filter substrate 401 and the array substrate100. Therefore, the liquid crystal material 602 is injected into betweenthe color filter substrate 401 and the array substrate 100.

According to a conventional liquid crystal display apparatus, cracks areformed between the sealant 408 and the insulation layer 306 or betweenthe insulation layer 306 and the gate insulation layer 305. Therefore,the liquid crystal material is not injected into between the colorfilter substrate 401 and the array substrate 100 due to poor vacuum inbonded module 601.

However, according to the present invention, the bonding of the sealant408 and the insulation layer 306 is reinforced to prevent the cracksbetween the sealant and the insulation layer. Therefore, the liquidcrystal material 602 is completely filled.

INDUSTRIAL APPLICABILITY

According to the present invention, a bonding of a color filtersubstrate and an array substrate is reinforced.

Furthermore, liquid crystal material is completely filled in between thecolor filter substrate and the array substrate.

Although the exemplary embodiments of the present invention have beendescribed, it is understood that the present invention should not belimited to these exemplary embodiments but various changes andmodifications can be made by one ordinary skilled in the art within thespirit and scope of the present invention as hereinafter claimed.

1. An array substrate comprising: a transparent substrate including adisplay region that displays an image, a peripheral region having adriving circuit for displaying an image through the display region, anda sealine region that surrounds the display region to define the displayregion and the peripheral region; a first insulation layer formed overthe transparent substrate, the first insulation layer having an openingwindow in the sealine region; and a pixel electrode formed on the firstinsulation layer of the display region.
 2. The array substrate of claim1, wherein the opening window penetrates the first insulation layer toexpose the transparent substrate.
 3. The array substrate of claim 1,wherein the first insulation layer corresponds to an organic layer. 4.The array substrate of claim 1, further comprising a second insulationlayer between the first insulation layer and the transparent substrate,and wherein the opening window exposes the second insulation layer. 5.The array substrate of claim 4, wherein the second insulation layercorresponds to a silicon nitride layer (SiNx).
 6. The array substrate ofclaim 1, further comprising a switching device having a gate electrode,a drain electrode that is electrically connected to the pixel electrodeand a source electrode, a gate line that is electrically connected tothe gate electrode, and a data line that is electrically connected tothe source electrode, wherein a portion of the data line overlaps withthe pixel electrode.
 7. A liquid crystal display apparatus comprising:an array substrate including: a transparent substrate including adisplay region that displays an image, a peripheral region having adriving circuit for displaying an image through the display region, anda sealine region that surrounds the display region to define the displayregion and the peripheral region; a first insulation layer formed overthe transparent substrate, the first insulation layer having an openingwindow in the sealine region; and a pixel electrode formed on the firstinsulation layer of the display region; a color filter substrate facingthe array substrate; a liquid crystal layer interposed between the arraysubstrate and the color filter substrate; and a sealing member firmed atthe opening window to bond the array substrate and the color filtersubstrate.
 8. The liquid crystal display apparatus of claim 7, whereinthe opening window penetrates the first insulation layer to expose thetransparent substrate, so that the sealing member makes contact with thetransparent substrate.
 9. The liquid crystal display apparatus of claim7, wherein the first insulation layer corresponds to an organic layer.10. The liquid crystal display apparatus of claim 7, further comprisinga second insulation layer between the first insulation layer and thetransparent substrate, and wherein the opening window exposes the secondinsulation layer, so that the sealing member makes contact with thesecond insulation layer.
 11. The liquid crystal display apparatus ofclaim 10, wherein the second insulation layer corresponds to a siliconnitride layer (SiNx).
 12. The liquid crystal display apparatus of claim7, further comprising a switching device having a gate electrode, adrain electrode that is electrically connected to the pixel electrodeand a source electrode, a gate line that is electrically connected tothe gate electrode, and a data line that is electrically connected tothe source electrode, wherein a portion of the data line overlaps withthe pixel electrode.
 13. A method of arming an array substrate,comprising: forming a first insulation layer over the transparentsubstrate including a display region that displays an image, aperipheral region having a driving circuit for displaying an imagethrough the display region, and a sealine region that surrounds thedisplay region to define the display region and the peripheral region;removing a portion of the first insulation layer to form an openingwindow in the sealine region; and arming a pixel electrode on the firstinsulation layer of the display region.
 14. The method of claim 13,wherein the opening window penetrates the first insulation layer toexpose the transparent substrate.
 15. The method of claim 13, whereinthe first insulation layer corresponds to an organic layer.
 16. Themethod of claim 13, further comprising firming a second insulation layerbetween the first insulation layer and the transparent substrate, andwherein the opening window exposes the second insulation layer.
 17. Themethod of claim 16, wherein the second insulation layer corresponds to asilicon nitride layer (SiNx).
 18. A method of arming a liquid crystaldisplay apparatus, comprising: forming an array substrate including i) atransparent substrate including a display region that displays an image,a peripheral region having a driving circuit for displaying an imagethrough the display region, and a sealine region that surrounds thedisplay region to define the display region and the peripheral region,ii) a first insulation layer formed over the transparent substrate, thefirst insulation layer having an opening window in the sealine region,and iii) a pixel electrode formed on the first insulation layer of thedisplay region; forming a sealing member at the opening window;attaching a color filter substrate to the sealing member to assemble thearray substrate to the color filter substrate; and forming a liquidcrystal layer between the array substrate and the color filtersubstrate.
 19. The method of claim 18, wherein the opening windowpenetrates the first insulation layer to expose the transparentsubstrate, so that the sealing member makes contact with the transparentsubstrate.
 20. The method of claim 18, wherein the first insulationlayer corresponds to an organic layer.
 21. The method of claim 18,wherein the array substrate further includes a second insulation layerbetween the first insulation layer and the transparent substrate, andthe opening window exposes the second insulation layer, so that thesealing member makes contact with the second insulation layer.
 22. Themethod of claim 21, wherein the second insulation layer corresponds to asilicon nitride layer (SiNx).
 23. The array substrate of claim 1,wherein the liquid crystal layer is injected between the array substrateand the color filter substrate by a vacuum injection method.